Array substrate, stretchable display device, and method for manufacturing array substrate

ABSTRACT

The present disclosure provides an array substrate, a stretchable display device, and a method for manufacturing an array substrate. The array substrate includes: a display area; a circuit area configured to provide an electrical signal to the display area; and a protection area including a plurality of island-shaped protection blocks, a plurality of first connection bridges and a plurality of second connection bridges, wherein each of the plurality of first connection bridges is configured to connect two adjacent island-shaped protection blocks of the plurality of island-shaped protection blocks, and the plurality of second connection bridges are configured to connect the protection area and the circuit area, and wherein the plurality of first connection bridges include a first flexible substrate, and the plurality of second connection bridges include a second flexible substrate.

RELATED APPLICATIONS

This application claims priority from Chinese Patent Application No.201910763153.4 filed on Aug. 19, 2019, the entire content of which isincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to the field of display technologies, andin particular, to an array substrate, a stretchable display device, anda method for manufacturing an array substrate.

BACKGROUND

Organic light-emitting diodes have the advantages of self-luminescence,ultra-light weight, ultra-thin thickness, fast response speed, wideviewing angle, low power consumption, etc. At the same time, compared toliquid crystal displays, organic stretchable display devices can be bentand have a wider application range. The development of organicstretchable display devices has accumulated technology for severalyears, and has gradually evolved from current bendable product forms tofoldable and even stretchable products.

SUMMARY

According to one aspect of the present disclosure, there is provided anarray substrate comprising: a display area; a circuit area configured toprovide an electrical signal to the display area; and a protection areacomprising a plurality of island-shaped protection blocks, a pluralityof first connection bridges and a plurality of second connectionbridges, wherein each of the plurality of first connection bridges isconfigured to connect two adjacent island-shaped protection blocks ofthe plurality of island-shaped protection blocks, and the plurality ofsecond connection bridges are configured to connect the protection areaand the circuit area, and wherein the plurality of first connectionbridges comprise a first flexible substrate, and the plurality of secondconnection bridges comprise a second flexible substrate.

In some embodiments of the present disclosure, the display areacomprises a plurality of island-shaped display blocks, a plurality ofthird connection bridges, and a plurality of fourth connection bridges,each of the plurality of third connection bridges is configured toconnect two adjacent island-shaped display blocks of the plurality ofisland-shaped display blocks, the plurality of fourth connection bridgesare configured to connect the display area and the circuit area, theplurality of third connection bridges comprise a third flexiblesubstrate, and the plurality of fourth connection bridges comprise afourth flexible substrate.

In some embodiments of the present disclosure, the circuit areacomprises a plurality of island-shaped circuit blocks and a plurality offifth connection bridges, each of the plurality of fifth connectionbridges is configured to connect two adjacent island-shaped circuitblocks of the plurality of island-shaped circuit blocks, and theplurality of fifth connection bridges comprise a fifth flexiblesubstrate.

In some embodiments of the present disclosure, the array substratefurther comprises a driver IC, the circuit area being located on theperiphery of the display area, the protection area being located on aside of the circuit area away from the display area, and the driver ICbeing located on a first side of the circuit area away from the displayarea, and the protection area comprising a first protection area, asecond protection area, and a third protection area, wherein the firstprotection area is located on a second side of the circuit area awayfrom the display area, and the second side is opposite to the firstside; the second protection area and the third protection area arerespectively located on a third side and a fourth side of the circuitarea away from the display area, and the third side is opposite to thefourth side.

In some embodiments of the present disclosure, each of the plurality ofisland-shaped protection blocks comprises: a first island-shapedflexible substrate; and a dielectric layer on the first island-shapedflexible substrate.

In some embodiments of the present disclosure, each of the plurality ofisland-shaped display blocks comprises: a second island-shaped flexiblesubstrate; a pixel driving circuit on the second island-shaped flexiblesubstrate; a light-emitting pixel on the pixel driving circuitconfigured to emit light in response to an electrical signal receivedfrom the pixel driving circuit; and an encapsulation layer on thelight-emitting pixel.

In some embodiments of the present disclosure, the plurality ofisland-shaped circuit blocks comprise: a first island-shaped circuitblock provided with a gate driving circuit; a second island-shapedcircuit block configured to provide a first power supply voltage; and athird island-shaped circuit block configured to provide a second powersupply voltage

In some embodiments of the present disclosure, the gate driving circuitcomprises a light emitting signal driving circuit and a scanning signaldriving circuit, and the first island-shaped circuit block comprises alight emitting signal driving circuit circuit block and a scanningsignal driving circuit circuit block.

In some embodiments of the present disclosure, each of the plurality ofisland-shaped circuit blocks comprises a third island-shaped flexiblesubstrate, the first island-shaped circuit block comprises the gatedriving circuit on the third island-shaped flexible substrate; thesecond island-shaped circuit block comprises a first power supply signalline on the third island-shaped flexible substrate; and the thirdisland-shaped circuit block comprises a second power supply signal lineon the third island-shaped flexible substrate.

In some embodiments of the present disclosure, the gate driving circuitcomprises a light emitting signal driving circuit and a scanning signaldriving circuit, the first island-shaped circuit block comprises a lightemitting signal driving circuit circuit block and a scanning signaldriving circuit circuit block, at least one of the plurality of fifthconnection bridges connecting the first island-shaped circuit block andthe second island-shaped circuit block that are adjacent comprises afirst connection wire on the fifth flexible substrate configured toelectrically connect the gate driving circuit and the first power supplysignal line that are adjacent and provide the first power supply voltageto the gate driving circuit; at least one of the plurality of fifthconnection bridges connecting adjacent light emitting signal drivingcircuit circuit blocks comprises a second connection wire on the fifthflexible substrate configured to electrically connect two adjacent lightemitting signal driving circuits; at least one of the plurality of fifthconnection bridges connecting adjacent scanning signal driving circuitcircuit blocks comprises a third connection wire on the fifth flexiblesubstrate configured to electrically connect two adjacent scanningsignal driving circuits; at least one of the plurality of fifthconnection bridges connecting the light emitting signal driving circuitcircuit block and the scanning signal driving circuit circuit block thatare adjacent comprises a fourth connection wire on the fifth flexiblesubstrate configured to electrically connect the light emitting signaldriving circuit and the scanning signal driving circuit that areadjacent and provide a light emitting signal to the scanning signaldriving circuit; and at least one of the plurality of fifth connectionbridges connecting adjacent third island-shaped circuit blocks comprisesa fifth connection wire on the fifth flexible substrate configured toelectrically connect two second power supply signal lines of adjacentthird island-shaped circuit blocks.

In some embodiments of the present disclosure, the circuit areacomprises a plurality of island-shaped circuit blocks, the plurality ofisland-shaped circuit blocks comprise a first island-shaped circuitblock provided with a gate driving circuit, a second island-shapedcircuit block configured to provide a first power supply voltage, and athird island-shaped circuit block configured to provide a second powersupply voltage, the second island-shaped circuit block comprises a firstpower supply signal line on the second island-shaped flexible substrate,the third island-shaped circuit block comprises a second power supplysignal line on the third island-shaped flexible substrate, at least oneof the plurality of fourth connection bridges connecting the thirdisland-shaped circuit block and one of the plurality island-shapeddisplay blocks that is adjacent to the third island-shaped circuit blockcomprises a first connection wire on the fourth flexible substrateconfigured to connect the second power supply signal line and the pixeldriving circuit and provide the second power supply voltage to the pixeldriving circuit; at least one of the plurality of fourth connectionbridges connecting the second island-shaped circuit block and one of theplurality of island-shaped display blocks that is adjacent to the secondisland-shaped circuit block comprises a second connection wire on thefourth flexible substrate configured to connect the first power supplysignal line and the pixel driving circuit and provide the first powersupply voltage to the pixel driving circuit; and at least one of theplurality of fourth connection bridges connecting the firstisland-shaped circuit block and one of the plurality of island-shapeddisplay blocks that is adjacent to the first island-shaped circuit blockcomprises a third connection wire on the fourth flexible substrateconfigured to connect the gate driving circuit and the pixel drivingcircuit and provide a driving signal to the pixel driving circuit.

In some embodiments of the present disclosure, the array substratefurther comprises a stretchable support base on a side of the firstisland-shaped flexible substrate facing away from the dielectric layer.

In some embodiments of the present disclosure, the support base is madeof PDMS.

According to another aspect of the present disclosure, there is provideda stretchable display device comprising any of the array substrates asdescribed above.

According to yet another aspect of the present disclosure, there isprovided a method for manufacturing an array substrate, comprising:forming a flexible substrate layer on a rigid substrate; forming adisplay area, a circuit area, and a protection area over the flexiblesubstrate layer and performing a patterning process on the flexiblesubstrate layer, the display area, the circuit area, and the protectionarea, so that the circuit area is configured to provide an electricalsignal to the display area, the protection area comprises a plurality ofisland-shaped protection blocks, a plurality of first connection bridgesand a plurality of second connection bridges, wherein each of theplurality of first connection bridges is configured to connect twoadjacent island-shaped protection blocks of the plurality ofisland-shaped protection blocks, and the plurality of second connectionbridges are configured to connect the protection area and the circuitarea, and wherein the plurality of first connection bridges comprise afirst flexible substrate, and the plurality of second connection bridgescomprise a second flexible substrate; and peeling off the rigidsubstrate.

In some embodiments of the present disclosure, the forming a displayarea, a circuit area, and a protection area over the flexible substratelayer and performing a patterning process on the flexible substratelayer, the display area, the circuit area, and the protection areafurther comprises: forming a buffer layer, an active layer, a gateinsulating layer, a gate, an interlayer insulating layer, and asource-drain electrode on the flexible substrate layer to form a firststack; and etching the formed first stack through a patterning processto form a first hollow area exposing the flexible substrate layer.

In some embodiments of the present disclosure, the forming a displayarea, a circuit area, and a protection area over the flexible substratelayer and performing a patterning process on the flexible substratelayer, the display area, the circuit area, and the protection areafurther comprises: forming a planarization layer to cover thesource-drain electrode, the exposed interlayer insulating layer, and theexposed flexible substrate layer; forming an anode electricallyconnected to the source-drain electrode and a pixel defining layer of alight-emitting pixel on the planarization layer; forming a hard maskmaterial layer covering the anode and the pixel defining layer of thelight-emitting pixel and the exposed planarization layer to form asecond stack; etching the formed second stack through a patterningprocess to form a second hollow area exposing the rigid substrate; andetching an area above the anode of the light-emitting pixel to exposethe anode, and forming a light emitting layer and a cathode of thelight-emitting pixel on the anode.

In some embodiments of the present disclosure, the forming a displayarea, a circuit area, and a protection area over the flexible substratelayer and performing a patterning process on the flexible substratelayer, the display area, the circuit area, and the protection areafurther comprises: forming a thin film encapsulation layer.

In some embodiments of the present disclosure, the method furthercomprises: after peeling off the rigid substrate, attaching astretchable support base on a side of the flexible substrate layer closeto the rigid substrate.

In some embodiments of the present disclosure, the display areacomprises OLED display blocks.

BRIEF DESCRIPTION OF THE DRAWINGS

The specific embodiments of the present disclosure will be furtherdescribed in detail below with reference to the accompanying drawings.

FIG. 1a is a schematic structural diagram of an array substrateaccording to an embodiment of the present disclosure;

FIG. 1b is a partial schematic view of the array substrate of FIG. 1 a;

FIG. 1c is a cross-sectional view of a first connection bridge and asecond connection bridge in an array substrate according to anembodiment of the present disclosure, taken along an A-B direction inFIG. 1 a;

FIG. 2 is a schematic structural diagram of an array substrate accordingto an embodiment of the present disclosure;

FIG. 3a is a schematic structural diagram of an array substrateaccording to an embodiment of the present disclosure;

FIG. 3b is a cross-sectional view of a third connection bridge and afourth connection bridge in the array substrate of FIG. 3a , taken alonga C-D direction;

FIG. 4a is a schematic structural diagram of an array substrateaccording to an embodiment of the present disclosure;

FIG. 4b is a cross-sectional view of a fifth connection bridge in thearray substrate of FIG. 4a , taken along an E-F direction;

FIG. 4c is a schematic cross-sectional view of an island-shapedprotection block according to an embodiment of the present disclosure,taken along a direction perpendicular to a plane where a first flexiblesubstrate is located;

FIG. 4d is a schematic cross-sectional view of an island-shaped displayblock according to an embodiment of the present disclosure, taken alonga direction perpendicular to a plane where the first flexible substrateis located;

FIG. 4e shows schematic cross-sectional views of a first island-shapedcircuit block, a second island-shaped circuit block, and a thirdisland-shaped circuit block according to an embodiment of the presentdisclosure, taken along a direction perpendicular to a plane where thefirst flexible substrate is located;

FIG. 4f and FIG. 4g respectively show partial structural schematic viewsof the array substrate of FIG. 4 a;

FIG. 5 is a schematic structural diagram of first island-shaped circuitblocks and an island-shaped display block according to an embodiment ofthe present disclosure;

FIG. 6 is a schematic cross-sectional view of an array substrateaccording to an embodiment of the present disclosure, taken along adirection perpendicular to a plane where the first flexible substrate islocated;

FIG. 7 is a schematic cross-sectional view of an array substrateaccording to an embodiment of the present disclosure, taken along adirection perpendicular to a plane where the first flexible substrate islocated;

FIG. 8a shows a flowchart of a method for manufacturing an arraysubstrate according to an embodiment of the present disclosure;

FIG. 8b illustrates a flowchart of a method of manufacturing an arraysubstrate according to an embodiment of the present disclosure; and

FIGS. 9a-9h are schematic cross-sectional views of different stages of amethod of manufacturing an array substrate according to an embodiment ofthe present disclosure, taken along a direction perpendicular to a planewhere the first flexible substrate is located.

It should be understood that the drawings are only for illustrativedescription of the embodiments of the present disclosure, and they arenot necessarily drawn to scale.

DETAILED DESCRIPTION OF EMBODIMENTS

In order to explain the present disclosure more clearly, the presentdisclosure is further described below with reference to the embodimentsand the accompanying drawings. Similar parts in the drawings areindicated by the same reference numerals. Those skilled in the artshould understand that what is specifically described below isillustrative and not restrictive, which should not limit the scope ofprotection of the present disclosure.

In the related art, a stretchable display device generally has a displayarea that undergoes deformation, and the periphery of the display deviceis fixed. When the display device undergoes stretch deformation, themiddle area of the display screen is jacked up. However, when the amountof stretch of the jacking is large, the four corner positions of thedisplay device will undergo greater deformation. Once the stretchinglimit is exceeded, the four corner positions of the display area areeasily damaged.

As shown in FIG. 1a to FIG. 1c , an embodiment of the present disclosureprovides an array substrate 100 including a display area 3; a circuitarea 2 configured to provide an electrical signal to the display area;and a protection area 1 including a plurality of island-shapedprotection blocks 11, a plurality of first connection bridges 12, and aplurality of second connection bridges 13, wherein each of the pluralityof first connection bridges 12 is configured to connect two adjacentisland-shaped protection blocks 11 and the plurality of secondconnection bridges 13 are configured to connect the protection area 1and the circuit area 2, and wherein the plurality of first connectionbridges include a first flexible substrate 121 and the plurality ofsecond connection bridges include a second flexible substrate 131.

In a specific example, as shown in FIG. 1a to FIG. 1c , the arraysubstrate includes the display area 3, the circuit area 2 surroundingthe display area, and the protection area 1 surrounding the circuitarea. The protection area 1 includes the island-shaped protection blocks11 arranged in an array with m rows and n columns, the first connectionbridge 12 and the second connection bridge 13. A hollow area is formedamong the island-shaped protection block 11, the first connection bridge12 and the second connection bridge 13. Adjacent island-shapedprotection blocks are connected through the first connection bridge 12,and the island-shaped protection blocks 11 are connected with thecircuit area through the second connection bridges 13. In someembodiments, n is a positive integer, which is greater than or equal to1 and less than or equal to 50; and m is a positive integer, which isgreater than or equal to 1 and less than or equal to 50. When stretchdeformation occurs, the island-shaped protection blocks 11 firstlyundergo deformation and release part of the pressure generated by thedeformation through the first connection bridges 12 and the secondconnection bridges 13, which effectively improves the stretch resistanceof the edge portion of the array substrate, and thereby improves theoverall stretch resistance of the array substrate.

Considering that a large number of signal lines are provided between thedisplay area and the circuit area of the array substrate and a driverIC, in an optional embodiment, as shown in FIG. 2, the array substrateincludes a driver IC 4, and the protection area includes a firstprotection area 101, a second protection area 102, and a thirdprotection area 103. The first protection area 101 is disposed in afirst direction relative to the driver IC 4, and the second protectionarea 102 and the third protection area 103 are disposed in a seconddirection relative to the driver IC 4. The first direction and thesecond direction are perpendicular to each other.

Specifically, as shown in FIG. 2, the first direction is perpendicularto the second direction, the first protection area is located at a sideof the display area away from the driver IC 4, and the second protectionarea and the third protection area are respectively located at two sidesof the display area in a second direction perpendicular to the driverIC. The first protection area, the second protection area, and the thirdprotection area can improve the stretch resistance of the edge positionof the display substrate, and at the same time ensure the normalconnection of the signal lines between the display area and the circuitarea with the driver IC.

In an optional embodiment, as shown in FIG. 3a to FIG. 3b , the displayarea 3 includes a plurality of island-shaped display blocks 31 arrangedin an array, third connection bridges 32 and fourth connection bridges33. The third connection bridges 32 and the fourth connection bridges 33include a third flexible substrate 321 and a fourth flexible substrate331, respectively. Each island-shaped display block 31 is provided withat least one display block, each third connection bridge 32 isconfigured to connect two adjacent island-shaped display blocks 31, andthe fourth connection bridge 33 is configured to connect the displayarea 3 and the circuit area 2. A hollow area is formed among theisland-shaped display block 31, the third connection bridge 32 and thefourth connection bridge 33. The third connection bridges 32 and thefourth connection bridges 33 are not only used to connect adjacentisland-shaped display blocks or used to connect the display area and thecircuit area, but also used to transmit electrical signals forcontrolling display in the display area, such as control signals,display signals, and power supply voltage signals for operating thelight-emitting pixels in the display area through connection wiresprovided in the third connection bridges 32 and the fourth connectionbridges 33. When stretch deformation occurs, the island-shaped displayblock 31 undergoes deformation and releases part of the pressure causedby the deformation through the third connection bridges 32, the fourthconnection bridges 33, the first connection bridges 12 and the secondconnection bridges 13, thereby improving the stretch resistance of thedisplay area and further improving the display effect and userexperience of the display device.

In an alternative embodiment, as shown in FIG. 4a to FIG. 4b , thecircuit area 2 includes a plurality of island-shaped circuit blocks 21arranged in an array and fifth connection bridges 22 for connectingadjacent island-shaped circuit blocks. The island-shaped circuit block21 includes a first island-shaped circuit block 201 provided with a gatedriving circuit, a second island-shaped circuit block 202 provided witha first power supply voltage, and a third island-shaped circuit block203 provided with a second power supply voltage. A hollow area is formedamong the first island-shaped circuit block 201, the secondisland-shaped circuit block 202, the third island-shaped circuit block203, and the fifth connection bridge 22. In some embodiments, the fifthconnection bridge 22 may include a fifth flexible substrate 221.

It should be understood that the first connection bridge, the secondconnection bridge, the third connection bridge, the fourth connectionbridge, and the fifth connection bridge may include the same flexiblesubstrate, that is, the first flexible substrate 121, the secondflexible substrate 131, the third flexible substrate 321, the fourthflexible substrate 331, and the fifth flexible substrate 221 may be madeof the same material, for example, made of polyimide. In someembodiments, any one or more of the first flexible substrate, the secondflexible substrate, the third flexible substrate, the fourth flexiblesubstrate, and the fifth flexible substrate may include other flexiblematerials, such as other organic materials and the like, which is notlimited in this disclosure.

In some embodiments, the first island-shaped circuit block 201 isprovided with the gate driving circuit, the second island-shaped circuitblock 202 is configured to provide a first power supply voltage (e.g.,VSS) to the island-shaped display block, and the third island-shapedcircuit block 203 is configured to provide a second power supply voltage(e.g., VDD) to the island-shaped display block. The fifth connectionbridges 22 are not only used to connect adjacent island-shaped circuitblocks, but also used to transmit electrical signals for controllingdisplay in the display area, such as control signals, display signals,and power supply voltage signals for operating the light-emitting pixelsin the display area through connection wires provided in the fifthconnection bridges 22. When stretch deformation occurs, the firstisland-shaped circuit blocks 201, the second island-shaped circuitblocks 202, and the third island-shaped circuit blocks 203 undergodeformation and release part of the pressure generated by thedeformation through the first connection bridges 12, the secondconnection bridges 13, the third connection bridges 32, the fourthconnection bridges 33 and the fifth connection bridges 22. That is, thecircuit area 2 is arranged as island-shaped structures and bridgestructures arranged in an array to further withstand external stretchdeformation, and the island-shaped structures such as the island-shapeddisplay blocks, the island-shaped circuit blocks and the island-shapedprotection blocks, and bridge structures such as the first connectionbridges, the second connection bridges, the third connection bridges,the fourth connection bridges, and the fifth connection bridges formoverall island-shaped structures and bridge structures arranged in thearray, thereby effectively improving the stretch resistance of the arraysubstrate.

Considering the structural characteristics of the gate driving circuitsuch as integrated configuration, in an optional embodiment, as shown inFIG. 4a , the gate driving circuit includes a light emitting signaldriving circuit (EGOA, EM-GOA) and a scanning signal driving circuit(GGOA, Gate-GOA). The first island-shaped circuit blocks arerespectively provided with an EGOA or a GGOA. Specifically, the firstisland-shaped circuit block 201 provided with the gate driving circuitmay be divided into an EGOA circuit block 2011 provided with the EGOAand a GGOA circuit block 2012 provided with the GGOA. The EGOA is usedto control the light emission of the light-emitting pixels of theelectroluminescent diode, and the GGOA is used to control the gatesignal of the gate. It should be understood that the present disclosuredoes not limit the positional relationship between the EGOA circuitblock 2011 and the GGOA circuit block 2012, and the positions of the twoin the circuit can be used interchangeably. The divided EGOA circuitblocks 2011 and GGOA circuit blocks 2012 can better set the gate drivingcircuit on different island-shaped circuit blocks, and effectivelyimprove the stretch resistance of the array substrate while ensuring thestable transmission of the signal lines of the array substrate.

FIG. 4c is a schematic cross-sectional view of an island-shapedprotection block 11 according to an embodiment of the presentdisclosure, taken along a direction perpendicular to a plane where thefirst flexible substrate is located. FIG. 4d is a schematiccross-sectional view of an island-shaped display block 31 according toan embodiment of the present disclosure, taken along a directionperpendicular to a plane where the first flexible substrate is located.FIG. 4e shows schematic cross-sectional views of a first island-shapedcircuit block 201, a second island-shaped circuit block 202, and a thirdisland-shaped circuit block 203 according to an embodiment of thepresent disclosure, taken along a direction perpendicular to a planewhere the first flexible substrate is located. In one embodiment, asshown in FIG. 4c to FIG. 4e , the island-shaped protection block 11 mayinclude a first island-shaped flexible substrate 111. Optionally, theisland-shaped protection block 11 may further include a dielectric layer112 on the first island-shaped flexible substrate 111. The island-shapeddisplay block 31 may include a second island-shaped flexible substrate211, a pixel driving circuit 212 such as one or more first thin filmtransistors, and a light-emitting pixel 213 formed on the secondisland-shaped flexible substrate 211. The light-emitting pixel 213 isdriven to emit light by the pixel driving circuit and is configured toemit light in response to an electrical signal received from the pixeldriving circuit. Optionally, the island-shaped display block may furtherinclude an encapsulation layer 214 on the light-emitting pixel 213. Thefirst island-shaped circuit block 201 may include a third island-shapedflexible substrate 2010, and a gate driving circuit 2015 formed on thethird island-shaped flexible substrate 2010, such as one or more secondthin film transistors. The second island-shaped circuit block 202 mayinclude the third island-shaped flexible substrate 2010, and a firstpower supply signal line 2022 formed on the third island-shaped flexiblesubstrate 2010 to provide a first power supply voltage for thelight-emitting pixel. The third island-shaped circuit block 203 mayinclude the third island-shaped flexible substrate 2010, and a secondpower supply signal line 2032 formed on the third island-shaped flexiblesubstrate 2010 to provide a second power supply voltage for thelight-emitting pixel. It should be understood that the island-shapedprotection block, island-shaped display block, and island-shaped circuitblock may include the same island-shaped flexible substrate, that is,the first island-shaped flexible substrate 111, the second island-shapedflexible substrate 211, and the third island-shaped flexible substrate2010 may be made of the same material, such as polyimide. In someembodiments, any one or more of the first island-shaped flexiblesubstrate, the second island-shaped flexible substrate, and the thirdisland-shaped flexible substrate may include other flexible materials,such as other organic materials and the like, which is not limited bythe present disclosure.

In some embodiments, the first connection bridge and the secondconnection bridge may also include a dielectric layer 112 formed on thefirst flexible substrate or the second flexible substrate. The thirdconnection bridge and the fourth connection bridge may also include adielectric layer 112 formed on the third flexible substrate or thefourth flexible substrate. The third connection bridge may also includea first conductive layer formed in the dielectric layer electricallyconnecting adjacent island-shaped display blocks. The fourth connectionbridge may also include a second conductive layer formed in thedielectric layer electrically connecting the island-shaped display blockand the island-shaped circuit block that are adjacent. The fifthconnection bridge may also include a dielectric layer, a thirdconductive layer formed in the dielectric layer electrically connectingadjacent island-shaped circuit blocks, and the like.

In some embodiments, as shown in FIG. 4f and FIG. 4g , the fifthconnection bridges may include: at least one fifth connection bridgeconnecting the first island-shaped circuit block (e.g., EGOA circuitblock 2011) and the second island-shaped circuit block 202 (e.g., VSS)that are adjacent, which includes a first connection wire 220 on thefifth flexible substrate configured to electrically connect the gatedriving circuit and the first power supply signal line that are adjacentand provide the first power supply voltage (e.g., VSS) to the gatedriving circuit; at least one fifth connection bridge connectingadjacent light emitting signal driving circuit circuit blocks (e.g.,EGOA circuit blocks 2011), which includes a second connection wire 222on the fifth flexible substrate configured to electrically connect twoadjacent light emitting signal driving circuits; at least one fifthconnection bridge connecting adjacent scanning signal driving circuitcircuit blocks (e.g., GGOA circuit blocks 2012), which includes a thirdconnection wire 224 on the fifth flexible substrate configured toelectrically connect two adjacent scanning signal driving circuits; andat least one fifth connection bridge connecting the light emittingsignal driving circuit circuit block and the scanning signal drivingcircuit circuit block (e.g., the EGOA circuit block 2011 and the GGOAcircuit block 2012) that are adjacent, which includes a fourthconnection wire 226 on the fifth flexible substrate configured toelectrically connect the light emitting signal driving circuit and thescanning signal driving circuit that are adjacent and provide a lightemitting signal and an optional first power supply voltage (e.g., VSS)to the GGOA circuit block 2012. In some embodiments, the fifthconnection bridge may further include at least one fifth connectionbridge connecting adjacent third island-shaped circuit blocks, whichincludes a fifth connection wire 227 on the fifth flexible substrateconfigured to electrically connect two second power supply signal linesof adjacent third island-shaped circuit blocks. In some embodiments, thefifth connection bridge may further include at least one fifthconnection bridge between two adjacent second island-shaped circuitblocks 202 (e.g., VSS), which includes a second island-shaped circuitblock connection wire 228 electrically connecting two adjacent firstpower supply signal lines. In some embodiments, the fifth connectionbridges may further include at least one connection bridge 229 betweenthe second island-shaped circuit block 202 (e.g., VSS) and the firstisland-shaped circuit block (e.g., EGOA circuit block 2011), which doesnot provide an electrical connection. In some embodiments, the fourthconnection bridges may include at least one fourth connection bridgeconnecting the third island-shaped circuit block and the island-shapeddisplay block (e.g., the third island-shaped circuit block 203 and theisland-shaped display block 31) that are adjacent, which includes afirst connection wire 330 on the fourth flexible substrate configured toconnect the second power supply signal line and the pixel drivingcircuit and provide a second power supply voltage (such as VDD) to thepixel driving circuit; at least one fourth connection bridge connectingthe second island-shaped circuit block and the island-shaped displayblock (e.g., the second island-shaped circuit block 202 and theisland-shaped display block 31) that are adjacent, which includes asecond connection wire 332 on the fourth flexible substrate configuredto connect the first power supply signal line and the pixel drivingcircuit and provide a first power supply voltage (such as VSS) to thepixel driving circuit; and at least one fourth connection bridgeconnecting the first island-shaped circuit block and the island-shapeddisplay block (e.g., the GGOA circuit block 2012 and the island-shapeddisplay block 31) that are adjacent, which includes a third connectionwire 334 on the fourth flexible substrate configured to connect the gatedriving circuit and the pixel driving circuit and provide a drivingsignal and an optional first power supply voltage to the pixel drivingcircuit. It should be understood that a data line or the like (notshown) is also connected between the driver IC 4 and the island-shapeddisplay block 31, and the data line can be connected to theisland-shaped display block 31 through the third island-shaped circuitblock 203, for example, which is not repeated here. In some embodiments,as shown in FIG. 4f and FIG. 4g , the first power supply voltage, suchas VSS, can be connected to the display area from different directions,so that the voltage drop during the conduction in the display area canbe reduced, and the display of the display area is thus more uniform.

In addition, in some embodiments, as shown in FIG. 4 g, the driver IC 4may be disposed on the IC substrate 40. In some embodiments, the ICsubstrate 40 may be formed of the same material as the island-shapedprotection block 11. In some embodiments, the IC substrate 40 may beformed in the same patterning process as the island-shaped protectionblock 11. In some embodiments, the driver IC 4 may be attached to the ICsubstrate 40 through a bonding process. In some embodiments, theisland-shaped protection block 11, the second island-shaped circuitblock, the EGOA circuit block, the GGOA circuit block, and the thirdisland-shaped circuit block 203 may be connected to the driver IC 4through the connection bridges 41, 42, 43, 44, 45 respectively. Theconnection bridges 42, 43, 44, and 45 may be provided with connectionwires for providing electrical connections between the secondisland-shaped circuit block, the EGOA circuit block, the GGOA circuitblock, and the third island-shaped circuit block 203 with the driver IC4. The specific structures of the connection bridges 41, 42, 43, 44, 45can refer to the structure of any one of the first connection bridge,the second connection bridge, the third connection bridge, the fourthconnection bridge, and the fifth connection bridge. This is not limitedin the present disclosure, as long as the stretch resistant function andthe electrical connection function can be realized.

In a specific example, FIG. 5 shows the EGOA circuit block 2011, theGGOA circuit block 2012, and the island-shaped display block 31 in thearray substrate. The EGOA circuit block 2011 and the GGOA circuit block2012 are connected through the fifth connection bridge. The GGOA circuitblock 2012 and the island-shaped display block 31 are connected throughthe fourth connection bridge. Specifically, the EGOA circuit block 2011is provided with the EGOA, including a TFTs and b capacitors, forexample, including 10 TFTs and 3 capacitors. The input signals duringthe operation of the EGOA include ECK signals, EBK signals, VGH signals,VGL signals and Input signals. The EGOA outputs EM signals, each EMsignal is used to control two rows of light-emitting pixels. The GGOAcircuit block 2012 is provided with the GGOA, including c TFTs and dcapacitors, for example, including 8 TFTs and 2 capacitors. The inputsignals during the operation of the GGOA include GCK signals, GBKsignals, VGH signals, VGL signals, and Input signals. The GGOA outputsthe Gate signal, and each Gate signal controls a row of light-emittingpixels. It should be understood that there may also be many otherconnection wires among the EGOA circuit block 2011, the GGOA circuitblock 2012 and the island-shaped display block 31 shown in FIG. 5. Forexample, a data line (not shown) and the like may also be connectedbetween adjacent island-shaped display blocks 31. Further, there may bethe connection wire (not shown in FIG. 5) for transmitting the firstpower supply voltage between the EGOA circuit block 2011 and GGOAcircuit block 2012 that are adjacent as described above, which is notrepeated here.

In some embodiments, a plurality of GGOAs form a gate control array, anda plurality of EGOAs form a light-emitting control array. The data linesfrom the driver IC and the connection wires from the GGOA and EGOAtransmit data signals and drive signals to the island-shaped displayblocks. The smallest light-emitting unit (such as a light-emittingpixel) in each island-shaped display block emits light in response tothe data signal and the driving signal. For example, the pixel drivingcircuit of each light-emitting pixel may include a 7T1C driving circuit.The light-emitting pixels can be scanned line by line by the drivingsignals, and different driving signals can be applied at different timesto control the on and off of the TFTs to realize the charging anddischarging of capacitors and the light emission of the light-emittingpixels, thereby lighting the display panel to achieve the display. Forspecific display processes and display principles, please refer torelated technologies in the art, which will not be repeated here in thisdisclosure.

In order to enable the array substrate to withstand the stretchdeformation uniformly to the maximum extent, in an optional embodiment,the sizes of the island-shaped protection blocks, the island-shapedcircuit blocks and the island-shaped display blocks are the same.Further, in another optional embodiment, the sizes of the firstconnection bridges, the second connection bridges, the third connectionbridges, the fourth connection bridges, and the fifth connection bridgesare the same. Island-shaped structures of the same sizes and bridgestructures of the same sizes arranged in an array are formed in thearray substrate, which effectively improves the stretch resistance ofthe array substrate.

In one embodiment, as shown in FIG. 6, the array substrate 100 includesa dielectric layer formed on the flexible substrate layer 301, and thedielectric layer includes a buffer layer 302, a gate insulating layer304, an interlayer insulating layer 306 and a planarization layer 309 onthe flexible substrate layer 301. A first thin film transistor and asecond thin film transistor include an active layer 303 on the flexiblesubstrate layer 301, a gate 305 on the gate insulating layer 304, and asource-drain electrode 307 on the interlayer insulating layer 306. Anencapsulation layer includes a hard mask layer 312 and a thin filmencapsulation layer 315 that cover the planarization layer 309, thefirst thin film transistor, and the second thin film transistor. Thelight-emitting pixel includes an Organic Light Emitting Diode (OLED),which includes an anode 310 on the planarization layer, a pixel defininglayer 311 surrounding the anode 310, and a light emitting layer and acathode 314 on the anode. The first power supply signal line, the secondpower supply signal line, the first conductive layer, the secondconductive layer, the third conductive layer, and the source-drainelectrodes of the first thin film transistor and the second thin filmtransistor may be disposed in the same layer. It is worth noting thatthose skilled in the art should understand that FIG. 6 is across-sectional view of the island-shaped display block area of thedisplay area of the array substrate and its surrounding structure, whichis only used to explain the specific structure of the array substrate,and the rest is not shown. The flexible substrate layer may be any oneof the first flexible substrate, the second flexible substrate, thethird flexible substrate, the fourth flexible substrate, the fifthflexible substrate, the first island-shaped flexible substrate, thesecond island-shaped flexible substrate and the third island-shapedflexible substrate described above, or other suitable flexiblesubstrates.

In some embodiments, the island-shaped display block is electricallyconnected to the adjacent island-shaped display block and theisland-shaped circuit block through the third connection bridge or thefourth connection bridge. A hollow area is formed among theisland-shaped display block, the third connection bridge and the fourthconnection bridge. The display area is subject to and releases thepressure caused by external stretch deformation through theisland-shaped display blocks, the third connection bridges, the fourthconnection bridges, and the hollow area.

In some embodiments, the first island-shaped circuit block includes theEGOA and GGOA. Electrical signals are transmitted between adjacentisland-shaped circuit blocks through the fifth connection bridge, thesecond island-shaped circuit block can provide the first power supplyvoltage to the light-emitting pixel through the first power supplysignal line and the fourth connection bridge, and the thirdisland-shaped circuit block can provide the second power supply voltageto the light-emitting pixel through the second power supply signal lineand the fourth connection bridge. A hollow area is formed between theisland-shaped circuit block and the fifth connection bridge. The circuitarea is subject to and releases the pressure caused by external stretchdeformation through the first island-shaped circuit block, the secondisland-shaped circuit block, the third island-shaped circuit block, thefifth connection bridge and the hollow area.

It should be understood that, in the embodiments of the presentdisclosure, the transistor may include a top-gate structure or abottom-gate structure, which is not limited in the present disclosure.As known to those skilled in the art, in some cases, the source anddrain of a transistor may be used interchangeably.

In some embodiments, there is no electrical signal transmission amongthe island-shaped protection block, the first connection bridge and thesecond connection bridge. The island-shaped protection block connectsthe adjacent island-shaped protection block through the first connectionbridge. The island-shaped protection block connects the adjacentisland-shaped circuit block through the second connection bridge. Ahollow area is formed among the island-shaped protection block, thefirst connection bridge and the second connection bridge. The protectionarea is subject to and releases the pressure caused by external stretchdeformation through the island-shaped protection block, the firstconnection bridge, the second connection bridge, and the hollow area.

In some embodiments, a structure of the plurality of island-shapedblocks and the plurality of connection bridges of the array substrate isformed through the island-shaped display blocks, the first island-shapedcircuit blocks, the second island-shaped circuit blocks, the thirdisland-shaped circuit blocks, the island-shaped protection blocks, thefirst connection bridges, the second connection bridges, the thirdconnection bridges, the fourth connection bridges, and the fifthconnection bridges, which effectively improves the stretch resistance ofthe array substrate.

Considering the overall structure of the array substrate, in analternative embodiment, as shown in FIG. 7, the array substrate 100further includes a stretchable support base 316, which is disposed on asurface of the flexible substrate layer 301 facing away from the bufferlayer 302. The stretchable support base 316 may be exposed in the hollowarea (e.g., a hollow area 313) among the island-shaped display blocks,island-shaped circuit blocks, island-shaped protection blocks, firstconnection bridges, second connection bridges, third connection bridges,fourth connection bridges, and fifth connection bridges. That is, in theprocess of manufacturing the array substrate, a hollow area may befirstly formed among the island-shaped display blocks, island-shapedcircuit blocks, island-shaped protection blocks, first connectionbridges, second connection bridges, third connection bridges, fourthconnection bridges, and fifth connection bridges, to facilitatesubsequent production and installation. Then, a layer of stretchablesupport base may be attached to a surface of the island-shaped displayblocks, island-shaped circuit blocks, island-shaped protection blocks,first connection bridges, second connection bridges, third connectionbridges, fourth connection bridges and fifth connection bridges togetherwith the hollow area facing away from the buffer layer 302, so that thestructure of the plurality of island-shaped blocks and the plurality ofconnection bridges of the array substrate can be effectively maintainedand supported within a certain stretching range.

By way of example, the stretchable support base may be made from anorganic material, such as PDMS.

It should be noted that, as explained herein, the terms “island-shapedprotection block”, “island-shaped display block”, and “island-shapedcircuit block” should be understood as different entities that do notexist continuously on the same physical plane, for example, islandstructures formed through the semiconductor patterning process. In someembodiments, as disclosed herein, different entities may be connected bya connection bridge, and there is a hollow area between differententities. In some embodiments, different island-shaped structures may belocated on the same continuous support base. An orthographic projectionof any one of the island-shaped protection block, the island-shapeddisplay block, and the island-shaped circuit block on the support basemay include a rectangle, a circle, a square, or any other suitableshape. Different orthographic projections may include the same shape ordifferent shapes, which is not limited in this disclosure. In addition,different orthographic projections may include the same or differentareas, which is not limited in this disclosure.

In some embodiments, corresponding to the array substrate provided inthe above embodiments, an embodiment of the present disclosure alsoprovides a method for manufacturing the above array substrate, as shownin FIG. 8a , including: S1, forming a flexible substrate layer on arigid substrate; S2, forming a display area, a circuit area, and aprotection area over the flexible substrate layer and performing apatterning process on the flexible substrate layer, the display area,the circuit area, and the protection area, so that the circuit area isconfigured to provide an electrical signal to the display area, theprotection area includes a plurality of island-shaped protection blocks,a plurality of first connection bridges and a plurality of secondconnection bridges, wherein each of the plurality of first connectionbridges is configured to connect two adjacent island-shaped protectionblocks, and the plurality of second connection bridges are configured toconnect the protection area and the circuit area, and wherein theplurality of first connection bridges include a first flexiblesubstrate, and the plurality of second connection bridges include asecond flexible substrate; and S3, peeling off the rigid substrate.

In an optional embodiment, forming a display area, a circuit area, and aprotection area over the flexible substrate layer and performing apatterning process on the flexible substrate layer, the display area,the circuit area, and the protection area further includes: forming thedisplay area including a plurality of island-shaped display blocks, aplurality of third connection bridges, and a plurality of fourthconnection bridges, wherein each of the plurality of third connectionbridges is configured to connect two adjacent island-shaped displayblocks, the plurality of fourth connection bridges are configured toconnect the display area and the circuit area, the plurality of thirdconnection bridges include a third flexible substrate, and the pluralityof fourth connection bridges include a fourth flexible substrate.

In another optional embodiment, forming a display area, a circuit area,and a protection area over the flexible substrate layer and performing apatterning process on the flexible substrate layer, the display area,the circuit area, and the protection area further includes: forming thecircuit area including a plurality of island-shaped circuit blocks and aplurality of fifth connection bridges, wherein each of the plurality offifth connection bridges is configured to connect two adjacentisland-shaped circuit blocks, and the plurality of fifth connectionbridges include a fifth flexible substrate.

The flexible substrate layer may be any one of the first flexiblesubstrate, the second flexible substrate, the third flexible substrate,the fourth flexible substrate, the fifth flexible substrate, the firstisland-shaped flexible substrate, the second island-shaped flexiblesubstrate and the third island-shaped flexible substrate describedabove, or other suitable flexible substrates.

In some embodiments, the island-shaped circuit block is formed toinclude a first island-shaped circuit block provided with a gate drivingcircuit, a second island-shaped circuit block configured to provide afirst power supply voltage, and a third island-shaped circuit blockconfigured to provide a second power supply voltage.

In a specific example, as shown in FIG. 8b and FIGS. 9a-9h , thespecific steps of the method for manufacturing an array substrate are asfollows.

S1: forming a flexible substrate layer on a rigid substrate.

In this embodiment, as shown in FIG. 9a , the rigid substrate 300 isglass, and the flexible substrate layer 301 is polyimide. The flexiblesubstrate layer 301 is formed on the rigid substrate 300.

S2: forming a display area, a circuit area, and a protection area overthe flexible substrate layer and performing a patterning process on theflexible substrate layer, the display area, the circuit area, and theprotection area, so that the circuit area is configured to provide anelectrical signal to the display area, the protection area includes aplurality of island-shaped protection blocks, a plurality of firstconnection bridges and a plurality of second connection bridges, whereineach of the plurality of first connection bridges is configured toconnect two adjacent island-shaped protection blocks, and the pluralityof second connection bridges are configured to connect the protectionarea and the circuit area, and wherein the plurality of first connectionbridges include a first flexible substrate, and the plurality of secondconnection bridges include a second flexible substrate.

In this embodiment, as shown in FIGS. 9b-9h , S2 may specificallyinclude the following steps.

S21: forming a buffer layer, an active layer, a gate insulating layer, agate, an interlayer insulating layer, and a source-drain electrode onthe flexible substrate layer to form a first stack;

In some embodiments, a buffer layer 302 is formed on the flexiblesubstrate layer 301. Active layers 303 are respectively formed on thebuffer layer 302 corresponding to an area where an island-shaped displayblock is to be formed and an area where a first island-shaped circuitblock is to be formed. A gate insulating layer 304 is formed to coverthe active layers 303 and the exposed buffer layer 302. Gates 305 areformed on the gate insulating layer 304 corresponding to the activelayers. An interlayer insulating layer 306 is formed to cover the gates305 and the exposed gate insulating layer 304.

Specifically, a buffer layer 302 is formed on the flexible substratelayer 301, and the buffer layer is an inorganic buffer layer.

Active layers 303 are respectively formed on the buffer layer 302corresponding to an area where an island-shaped display block is to beformed and an area where a first island-shaped circuit block is to beformed. That is, a first active layer of a first thin film transistor isformed corresponding to an area where the island-shaped display block isto be formed and a second active layer of a second thin film transistoris formed corresponding to an area where a first island-shaped circuitblock is to be formed.

A gate insulating layer 304 is formed to cover the active layers 303 andthe exposed buffer layer 302, that is, the gate insulating layer 304covers the first active layer, the second active layer, and the exposedbuffer layer 302.

Gates 305 are formed on the gate insulating layer 304 corresponding tothe active layers, that is, a first gate corresponding to the firstactive layer of the first thin film transistor is formed on the gateinsulating layer 304, and a second gate corresponding to the secondactive layer of the second thin film transistor is formed on the gateinsulating layer 304.

An interlayer insulating layer 306 is formed to cover the gates 305 andthe exposed gate insulating layer 304. That is, the interlayerinsulating layer 306 covers the first gate of the first thin filmtransistor, the second gate of the second thin film transistor, and theexposed gate insulating layer 304.

A source-drain electrode 307 penetrating the interlayer insulating layeris formed on the interlayer insulating layer 306.

In this embodiment, as shown in FIG. 9b , on the interlayer insulatinglayer 306, a first source-drain electrode penetrating to the firstactive layer of the first thin film transistor is formed on an areacorresponding to the island-shaped display block, a second source-drainelectrode penetrating to the second active layer of the second thin filmtransistor is formed on an area corresponding to the first island-shapedcircuit block, a first power supply signal line is formed on an areacorresponding to the second island-shaped circuit block, a second powersupply signal line is formed on an area corresponding to the thirdisland-shaped circuit block, a first conductive layer is formed on anarea corresponding to the third connection bridge, a second conductivelayer is formed on an area corresponding to the fourth connectionbridge, and a third conductive layer is formed on an area correspondingto the fifth connection bridge. The first power supply signal line andthe second power supply signal line are used to supply power to thelight-emitting pixel to be formed, and the first conductive layer andthe second conductive layer are used to transmit electrical signalsbetween adjacent island-shaped display blocks and between theisland-shaped display block and the island-shaped circuit block, and thethird conductive layer is used to transmit electrical signals betweenadjacent island-shaped circuit blocks.

S22: etching the formed first stack through a patterning process to forma first hollow area exposing the flexible substrate layer.

Specifically, patterning is performed to form a plurality ofisland-shaped protection blocks arranged in an array, first connectionbridges and second connection bridges in the protection area, to form aplurality of island-shaped display blocks arranged in an array, thirdconnection bridges and fourth connection bridges in the display area,and to form a plurality of island-shaped circuit blocks arranged in anarray and fifth connection bridges in the circuit area. The flexiblesubstrate layer is exposed among the plurality of island-shapedprotection blocks, the plurality of island-shaped display blocks, andthe plurality of island-shaped circuit blocks.

In this embodiment, as shown in FIG. 9c , the first hollow area 308 isformed by patterning. For example, an area other than the first hollowarea is covered by a photoresist, and the dry etching is used todirectly etch to the flexible substrate layer 301. After the etching iscompleted, the plurality of island-shaped protection blocks arranged inan array, first connection bridges and second connection bridges areformed in the protection area, the plurality of island-shaped displayblocks arranged in an array, third connection bridges and fourthconnection bridges are formed in the display area, and the plurality ofisland-shaped circuit blocks arranged in an array and fifth connectionbridges are formed in the circuit area. That is, a structure of aplurality of island-shaped blocks and a plurality of connection bridgesarranged in an array of the array substrate is formed.

S23: forming a planarization layer to cover the source-drain electrode,the exposed interlayer insulating layer, and the exposed flexiblesubstrate layer.

In this embodiment, as shown in FIG. 9d , the planarization layer 309covering the source-drain electrode 307 specifically includes coveringthe first source-drain electrode of the first thin film transistorcorresponding to the island-shaped display block, the secondsource-drain electrode of the second thin film transistor correspondingto the first island-shaped circuit block, the first power supply signalline corresponding to the second island-shaped circuit block, the secondpower supply signal line corresponding to the third island-shapedcircuit block, the first conductive layer corresponding to the thirdconnection bridge, the second conductive layer corresponding to thefourth connection bridge, and the third conductive layer correspondingto the fifth connection bridge.

S24: forming an anode electrically connected to the source-drainelectrode and a pixel defining layer of a light-emitting pixel on theplanarization layer.

In this embodiment, as shown in FIG. 9e , an anode 310 of alight-emitting pixel is formed on a corresponding area of theplanarization layer 309. For example, the pixel defining layer 311 isformed by a patterning process, the planarization layer 309 is punched,and the anode material of the light-emitting pixel is deposited, to formthe anode 310 with a size corresponding to the pixel size.

S25: forming a hard mask material layer covering the anode and the pixeldefining layer of the light-emitting pixel and the exposed planarizationlayer to form a second stack.

In this embodiment, as shown in FIG. 9f , considering that the organicmaterial (for example, the flexible substrate layer and theplanarization layer) in the hollow area to be formed needs to be etched,a hard mask material layer 312 is added, such as SiNx or SiONx, coveringthe anode and the pixel defining layer of the light-emitting pixel andthe exposed planarization layer to form a second stack.

S26: etching the formed second stack through a patterning process toform a second hollow area exposing the rigid substrate.

In this embodiment, as shown in FIG. 9g , the second hollow area 313 isformed by patterning. For example, the hard mask material layercorresponding to the second hollow area to be formed is firstly etchedaway by an exposure and etching process, and then the planarizationlayer and the flexible substrate layer corresponding to the secondhollow area to be formed are etched away by an etching process, therebyforming a second hollow area 313 penetrating to the rigid substrate 300.

S27: etching an area above the anode of the light-emitting pixel toexpose the anode, and forming a light emitting layer and a cathode ofthe light-emitting pixel on the anode.

S28: forming a thin film encapsulation layer.

In this embodiment, as shown in FIG. 9h , a light emitting layer and acathode 314 of the light-emitting pixel are formed. For example, thearea corresponding to the light emitting layer and the cathode of thelight-emitting pixel (e.g., OLED) to be formed is firstly etched away toexpose the anode, and then the light emitting layer and the cathode 314are evaporated. The array substrate is thin-film encapsulated to form athin film encapsulation layer 315.

S3: peeling off the rigid substrate.

Considering the overall structure of the array substrate, in an optionalembodiment, S3 of peeling off the rigid substrate further includes:

peeling off the rigid substrate 300 from a side of the flexiblesubstrate layer 301 close to the rigid substrate 300.

In this embodiment, as shown in FIG. 6, the rigid substrate 300 ispeeled off. For example, the rigid substrate 300 is peeled from theflexible substrate layer 301 by a laser stripping process to form thestructure of a plurality of island-shaped blocks and a plurality ofconnection bridges of the array substrate, which effectively improvesthe stretch resistance of the array substrate.

Finally, the method may also include S4: after peeling off the rigidsubstrate, attaching a stretchable support base on a side of theflexible substrate layer close to the rigid substrate.

In this embodiment, as shown in FIG. 7, through an adhesive, astretchable support base 316 may be attached to a surface of theflexible substrate layer of the island-shaped display blocks,island-shaped circuit blocks, island-shaped protection blocks, firstconnection bridges, second connection bridges, third connection bridges,fourth connection bridges and fifth connection bridges facing away fromthe buffer layer 302, so that a structure of the plurality ofisland-shaped blocks and the plurality of connection bridges of thearray substrate can be effectively maintained and supported within acertain stretching range, to facilitate subsequent production andinstallation.

On the basis of the above array substrate, an embodiment of the presentdisclosure further provides a stretchable display device including theabove array substrate. The display device can withstand external stretchdeformation and the display effect and user experience of the displaydevice can be effectively improved.

The present disclosure provides an array substrate, a stretchabledisplay device, and a method for manufacturing an array substrate. Thestructure of islands and bridges of the island-shaped display blocks,the island-shaped circuit blocks, the island-shaped protection blocks,the first connection bridges, the second connection bridges, the thirdconnection bridges, the fourth connection bridges, and the fifthconnection bridges withstands the deformation generated at the displayedge when the display device is stretched, effectively alleviating thestretch deformation of the edge position of the display device, therebyremedying the problems in the related art, effectively improving thestretch resistance of the display device and improving the userexperience.

It will be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, without departing from the scopeof the present specification, a first element may be referred to as asecond element, and similarly, a second element may be referred to as afirst element. In addition, the terms “first,” “second,” etc. are usedfor descriptive purposes only, and cannot be understood as indicating orsuggesting relative importance or implicitly indicating the number oftechnical features indicated. Thus, the features defined as “first”,“second”, etc. may explicitly or implicitly include at least one of thefeatures. In the description of the present disclosure, the meaning of“a plurality” is at least two, for example, two, three, etc., unless itis explicitly and specifically defined otherwise.

The scope of the optional embodiments of the present disclosurecomprises additional implementations in which the functions may beperformed in an order not shown or discussed, e.g., in a substantiallysimultaneous manner or in the reverse order, depending on the functioninvolved, which will be understood by those skilled in the art.

Obviously, the above-mentioned embodiments of the present disclosure aremerely examples for clearly explaining the present disclosure, and arenot intended to limit the implementation of the present disclosure. Forthose of ordinary skill in the art, based on the above description,there are other different forms of changes or variations, and allimplementations cannot be exhausted here. Any obvious changes orvariations that belong to the technical solutions of the presentdisclosure are still within the protection scope of the presentdisclosure.

What is claimed is:
 1. An array substrate comprising: a display area; acircuit area configured to provide an electrical signal to the displayarea; and a protection area comprising a plurality of island-shapedprotection blocks, a plurality of first connection bridges and aplurality of second connection bridges, wherein each of the plurality offirst connection bridges is configured to connect two adjacentisland-shaped protection blocks of the plurality of island-shapedprotection blocks, and the plurality of second connection bridges areconfigured to connect the protection area and the circuit area, andwherein the plurality of first connection bridges comprise a firstflexible substrate, and the plurality of second connection bridgescomprise a second flexible substrate.
 2. The array substrate accordingto claim 1, wherein the display area comprises a plurality ofisland-shaped display blocks, a plurality of third connection bridges,and a plurality of fourth connection bridges, each of the plurality ofthird connection bridges is configured to connect two adjacentisland-shaped display blocks of the plurality of island-shaped displayblocks, the plurality of fourth connection bridges are configured toconnect the display area and the circuit area, the plurality of thirdconnection bridges comprise a third flexible substrate, and theplurality of fourth connection bridges comprise a fourth flexiblesubstrate.
 3. The array substrate according to claim 1, wherein thecircuit area comprises a plurality of island-shaped circuit blocks and aplurality of fifth connection bridges, each of the plurality of fifthconnection bridges is configured to connect two adjacent island-shapedcircuit blocks of the plurality of island-shaped circuit blocks, and theplurality of fifth connection bridges comprise a fifth flexiblesubstrate.
 4. The array substrate according to claim 1, furthercomprising a driver IC, the circuit area being located on the peripheryof the display area, the protection area being located on a side of thecircuit area away from the display area, and the driver IC being locatedon a first side of the circuit area away from the display area, and theprotection area comprising a first protection area, a second protectionarea, and a third protection area, wherein the first protection area islocated on a second side of the circuit area away from the display area,and the second side is opposite to the first side; the second protectionarea and the third protection area are respectively located on a thirdside and a fourth side of the circuit area away from the display area,and the third side is opposite to the fourth side.
 5. The arraysubstrate according to claim 1, wherein each of the plurality ofisland-shaped protection blocks comprises: a first island-shapedflexible substrate; and a dielectric layer on the first island-shapedflexible substrate.
 6. The array substrate according to claim 2, whereineach of the plurality of island-shaped display blocks comprises: asecond island-shaped flexible substrate; a pixel driving circuit on thesecond island-shaped flexible substrate; a light-emitting pixel on thepixel driving circuit configured to emit light in response to anelectrical signal received from the pixel driving circuit; and anencapsulation layer on the light-emitting pixel.
 7. The array substrateaccording to claim 3, wherein the plurality of island-shaped circuitblocks comprise: a first island-shaped circuit block provided with agate driving circuit; a second island-shaped circuit block configured toprovide a first power supply voltage; and a third island-shaped circuitblock configured to provide a second power supply voltage.
 8. The arraysubstrate according to claim 7, wherein the gate driving circuitcomprises a light emitting signal driving circuit and a scanning signaldriving circuit, and the first island-shaped circuit block comprises alight emitting signal driving circuit circuit block and a scanningsignal driving circuit circuit block.
 9. The array substrate accordingto claim 7, wherein each of the plurality of island-shaped circuitblocks comprises a third island-shaped flexible substrate, the firstisland-shaped circuit block comprises the gate driving circuit on thethird island-shaped flexible substrate; the second island-shaped circuitblock comprises a first power supply signal line on the thirdisland-shaped flexible substrate; and the third island-shaped circuitblock comprises a second power supply signal line on the thirdisland-shaped flexible substrate.
 10. The array substrate according toclaim 9, wherein the gate driving circuit comprises a light emittingsignal driving circuit and a scanning signal driving circuit, the firstisland-shaped circuit block comprises a light emitting signal drivingcircuit circuit block and a scanning signal driving circuit circuitblock, at least one of the plurality of fifth connection bridgesconnecting the first island-shaped circuit block and the secondisland-shaped circuit block that are adjacent comprises a firstconnection wire on the fifth flexible substrate configured toelectrically connect the gate driving circuit and the first power supplysignal line that are adjacent and provide the first power supply voltageto the gate driving circuit; at least one of the plurality of fifthconnection bridges connecting adjacent light emitting signal drivingcircuit circuit blocks comprises a second connection wire on the fifthflexible substrate configured to electrically connect two adjacent lightemitting signal driving circuits; at least one of the plurality of fifthconnection bridges connecting adjacent scanning signal driving circuitcircuit blocks comprises a third connection wire on the fifth flexiblesubstrate configured to electrically connect two adjacent scanningsignal driving circuits; at least one of the plurality of fifthconnection bridges connecting the light emitting signal driving circuitcircuit block and the scanning signal driving circuit circuit block thatare adjacent comprises a fourth connection wire on the fifth flexiblesubstrate configured to electrically connect the light emitting signaldriving circuit and the scanning signal driving circuit that areadjacent and provide a light emitting signal to the scanning signaldriving circuit; and at least one of the plurality of fifth connectionbridges connecting adjacent third island-shaped circuit blocks comprisesa fifth connection wire on the fifth flexible substrate configured toelectrically connect two second power supply signal lines of adjacentthird island-shaped circuit blocks.
 11. The array substrate according toclaim 6, wherein the circuit area comprises a plurality of island-shapedcircuit blocks, the plurality of island-shaped circuit blocks comprise afirst island-shaped circuit block provided with a gate driving circuit,a second island-shaped circuit block configured to provide a first powersupply voltage, and a third island-shaped circuit block configured toprovide a second power supply voltage, the second island-shaped circuitblock comprises a first power supply signal line on the secondisland-shaped flexible substrate, the third island-shaped circuit blockcomprises a second power supply signal line on the third island-shapedflexible substrate, at least one of the plurality of fourth connectionbridges connecting the third island-shaped circuit block and one of theplurality island-shaped display blocks that is adjacent to the thirdisland-shaped circuit block comprises a first connection wire on thefourth flexible substrate configured to connect the second power supplysignal line and the pixel driving circuit and provide the second powersupply voltage to the pixel driving circuit; at least one of theplurality of fourth connection bridges connecting the secondisland-shaped circuit block and one of the plurality of island-shapeddisplay blocks that is adjacent to the second island-shaped circuitblock comprises a second connection wire on the fourth flexiblesubstrate configured to connect the first power supply signal line andthe pixel driving circuit and provide the first power supply voltage tothe pixel driving circuit; and at least one of the plurality of fourthconnection bridges connecting the first island-shaped circuit block andone of the plurality of island-shaped display blocks that is adjacent tothe first island-shaped circuit block comprises a third connection wireon the fourth flexible substrate configured to connect the gate drivingcircuit and the pixel driving circuit and provide a driving signal tothe pixel driving circuit.
 12. The array substrate according to claim 5,further comprising a stretchable support base on a side of the firstisland-shaped flexible substrate facing away from the dielectric layer.13. The array substrate according to claim 12, wherein the support baseis made of PDMS.
 14. A stretchable display device comprising the arraysubstrate according to claim
 1. 15. A method for manufacturing an arraysubstrate, comprising: forming a flexible substrate layer on a rigidsubstrate; forming a display area, a circuit area, and a protection areaover the flexible substrate layer and performing a patterning process onthe flexible substrate layer, the display area, the circuit area, andthe protection area, so that the circuit area is configured to providean electrical signal to the display area, the protection area comprisesa plurality of island-shaped protection blocks, a plurality of firstconnection bridges and a plurality of second connection bridges, whereineach of the plurality of first connection bridges is configured toconnect two adjacent island-shaped protection blocks of the plurality ofisland-shaped protection blocks, and the plurality of second connectionbridges are configured to connect the protection area and the circuitarea, and wherein the plurality of first connection bridges comprise afirst flexible substrate, and the plurality of second connection bridgescomprise a second flexible substrate; and peeling off the rigidsubstrate.
 16. The method according to claim 15, wherein the forming adisplay area, a circuit area, and a protection area over the flexiblesubstrate layer and performing a patterning process on the flexiblesubstrate layer, the display area, the circuit area, and the protectionarea further comprises: forming a buffer layer, an active layer, a gateinsulating layer, a gate, an interlayer insulating layer, and asource-drain electrode on the flexible substrate layer to form a firststack; and etching the formed first stack through a patterning processto form a first hollow area exposing the flexible substrate layer. 17.The method according to claim 16, wherein the forming a display area, acircuit area, and a protection area over the flexible substrate layerand performing a patterning process on the flexible substrate layer, thedisplay area, the circuit area, and the protection area furthercomprises: forming a planarization layer to cover the source-drainelectrode, the exposed interlayer insulating layer, and the exposedflexible substrate layer; forming an anode electrically connected to thesource-drain electrode and a pixel defining layer of a light-emittingpixel on the planarization layer; forming a hard mask material layercovering the anode and the pixel defining layer of the light-emittingpixel and the exposed planarization layer to form a second stack;etching the formed second stack through a patterning process to form asecond hollow area exposing the rigid substrate; and etching an areaabove the anode of the light-emitting pixel to expose the anode, andforming a light emitting layer and a cathode of the light-emitting pixelon the anode.
 18. The method according to claim 17, wherein the forminga display area, a circuit area, and a protection area over the flexiblesubstrate layer and performing a patterning process on the flexiblesubstrate layer, the display area, the circuit area, and the protectionarea further comprises: forming a thin film encapsulation layer.
 19. Themethod according to claim 15, further comprising: after peeling off therigid substrate, attaching a stretchable support base on a side of theflexible substrate layer close to the rigid substrate.
 20. The methodaccording to claim 15, wherein the display area comprises OLED displayblocks.